New version of Genesis v16.0 release
Vanderplaats Research and Development, Inc has just released GENESIS v16.0 and its graphical user interface Design Studio for GENESIS v16.0. The new release includes:
- Reliability Analysis
- Reliability Based Optimization
- Multi-model Optimization
- Heat Transfer Topology Optimization
- New Fabrication Constraints Option for Casting Constraints in Topology
- Enhanced Contact Analysis
- Enhanced Super-elements
- Updated DOT Optimizer
LS-DYNA Conference in Europe - May 9 to 11, 2017
Call for papers:
We kindly invite all users of LS-DYNA, LS_OPT, and LS-TaSC to take advantage of this fantastic opportunity to showcase their work. The Conference is your chance to talk with industry experts, catch up with colleagues and enjoy time exploring new ideas.
- Paper presentation - Listen to the presentation of LS-Dyna developers and other users. Present your work internationally and share knowledge.
- Exhibition – You are encouraged to exhibit your hardware or software products at the conference
- Training – LS-DYNA Training courses arranged before, during and after the conference
Abstract submission: 17 February 2017
Author notification: 27 February 2017
Final paper deadline: 27 March 2017
Conference dates: 9 - 11 May 2017
A-5020 Salzburg, Austria
For more information: www.dynamore.de/conf2017
LS-DYNA New version release R9.0
We would like to inform you that LSTC has released LS-DYNA version R9.0. The new version comes with bug fixes and enhanced features.
For more information, please do not hesitate to contact us.
14th LS-DYNA® International Conference
June 12-14, 2016 , Edward Village Michigan, Dearborn, MI
Livermore Software Technology Corp. (LSTC) and DYNAmore Germany welcome you to the 14th International LS-DYNA Conference & the 14th International LS-DYNA User Meeting.
The conference is an opportunity to showcase your company, present your LS-DYNA application use to engineers, industry leaders, consultants, professors, researchers, students, and interested parties. A forum to share knowledge and meet colleagues.
Platinum Sponsors for 2016
Conference Bag ETA
Reception - Sponsors listed (sidebar Reception Sponsors)
For details, go to ls-dynaconferences.com
QForm VX was presented at ET'16 conference in USA
QuantorForm Ltd., Micas Simulations Ltd. and Forge Technology Inc. presented a new software for profile extrusion simulation and optimization QForm VX at the 11th International Aluminum Extrusion Technology Seminar & Exposition on May 2-6, 2016 in Chicago, Illinois USA.
QForm VX is the only program available that integrates die design and simulation. The new QForm VX extrusion simulation program builds on the unique architecture, data structure and interface its popular predecessor, QForm V8 metal forming simulation software. The new program introduces novel simulation methods that achieve the best performance and accuracy in the industry. QForm VX, combined with our QExDD program, provide quick and easy die design integrated seamlessly with simulation.
Find more about QForm VX